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Product
Encoder Stress Pattern
ESP™
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SRI's ESP is a sophisticated video clip consisting of specialized and complex artificial test patterns that stress various aspects of processing to quickly reveal television encoder deficiencies. Its unique motion sequences allow users to visually evaluate and objectively compare the quality and performance of standard- and high-definition encoders.
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Product
Heat Stress
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Our lineup of heat stress meters include the WBGT (Wet Bulb Globe Temperature) meters, which provides the most accurate determination of the heat stress index based on the cumulative effect of air temperature, air movement, relative humidity, and radiant heat.
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Product
Stress Test Software
PassMark BurnInTest
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PassMark BurnInTest? is a software tool that allows all the major sub-systems of a computer to be simultaneously stress tested for endurance, reliability and stability.
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Product
PCB Interconnect Stress Test System
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PWB Interconnect Solutions Inc.
Integrated package including PC, Software with real time graphing and all related systems and hardware for 8 head, dual sense testing model IST-HC
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Product
Creep and Stress Rupture Tester
QualiCreep Series
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Qualitest Creep and Stress Rupture Tester - QualiCreep Series is mainly designed to perform Creep and Stress Rupture testing of a wide variety of materials to both standard and customized specifications such as ASTM E139, ISO 204, ISO/R 206 and similar international standards. These machines are capable of covering the determination of the amount of deformation as a function of time (creep test) and the measurement of the time for fracture to occur when sufficient force is present (rupture test) for materials when under constant tensile forces at constant temperature. Qualitest offers three models electronic high temperature creep-testing machine with full closed-loop servo-control in capacities from 10kN to 500kN.
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Product
Optical Receiver Stress Test
N4917BACA
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A complete, automated, and repeatable solution for optical receiver stress test.
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Product
Backgrinding & Stress Relief
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Grinding and Dicing Services, Inc.
GDSI delivers complete backgrinding solutions to the semiconductor, MEMS and biomedical industries. Backgrinding is a necessary process step to reduce wafer thickness prior to dicing and final assembly. By utilizing fully automated grinders staffed by highly qualified engineers, GDSI’s grinding procedures produce unsurpassed precision and repeatability.
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Product
Shear Stress Sensors
DirectShear™
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Micromachined floating element shear stress sensor that enables time-resolved, one-dimensional, direct shear stress measurements. Direct measurement of shear stress — no heat transfer calibration. Non-intrusive — minimal flow disturbance. Simultaneous mean and fluctuating shear stress measurements. High resolution, dynamic range and bandwidth. Highly accurate, quantitative measurements.
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Product
Optical Receiver Stress Test Solution
N4917B
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The N4917B software provides an automated standard compliant stressed receiver sensitivity test according to 100GBASE-LR4, ER4 and SR4 test specification. In order to do this kind of test, several test instruments such as a bit error ratio tester, digital sampling oscilloscope, optical reference transmitter and tunable laser source are required to operate together to achieve a compliant, repeatable optical stressed eye. This stressed eye is then fed to the receiver under test, where bit error ratio is measured under the stress conditions as defined in the standard.
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Product
Accelerated Stress Test Chamber
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CSZ's accelerated stress test chambers combine mechanical refrigeration; LN2 cooling and high velocity air flow for fast product temperature change rates. Chambers are typically designed with a change rate up to 30C (54F) per minute based upon the part temperature. Common uses are production stress testing circuit boards, electronic drives, assemblies, etc. Design allows the user to quickly control and change the temperature of the product.
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Product
Strain Measurements and Experimental Stress Analysis
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Experimental structural testing using strain gauges is necessary in a wide range of applications from airframes and sub-assemblies down to individual components such as turbine blades, satellites, wind turbines, buildings, bridges and many others. These tests enable the engineers to compare the acquired data with the predicted results from the design calculations.
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Product
Structural & Stress Analysis
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Structural analysis is critical because it can determine cause and predict failure – evaluating whether or not a specific structural design will be able to withstand the external and internal stresses and forces expected for the design.
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Product
PWB Interconnect Stress Test
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PWB Interconnect Solutions Inc.
Services to test the reliability of Printed Circuit Boards. PCBs).Coupon Inspection and Electrical Prescreen. Coupon Testing. Failure Location via I/R Photo Imagery. Failure Analysis.
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Product
Plant Stress Kit
PSK
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The Y(II) meter was designed to provide an inexpensive way to measure the fast light adapted Y(II) or F/FM' protocol and to make it available to more people that need it.
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Product
Environmental Stress Screening
E.S.S
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King Design Industrial Co., Ltd.
E.S.S system could find most potential and hiding defects earlier by checking the physical property of allmaterials and components, and make use of their nature response under Environmental Stress. Through our screening will to pick out all potential and hiding defects in advance and improving the product's reliability inling. It benefits the manufacturer and customer mutually.
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Product
Extremely Accelerated Stress Test Chambers
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The extremely accelerated stress environment is defined by high temperature, high humidity and high pressure. WEIBER provides humidity resistance evaluation test for electronics components through customized Extremely Accelerated Stress Test Chamber. This chamber provides high performance test in minimal amount of time according to international IEC 60068-2-66 standard. This chamber also known as Accelerated Stress Test Chamber, Halt and Hass Test Chamber, Halt Test Chamber and Hass Test Chamber.This chamber reduces the time taken for humidity testing in electronic components. 2 types of tests saturated and unsaturated extremely accelerated stress test can be performed. In saturated test the temperature is maintained at 1210C at 100%RH, and for unsaturated temperature of 110, 120, 1300C is maintained at 85%RH. Normally for electronic components unsaturated type test is done.
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Product
Stress Mapping System
900 Series
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Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature. NEW: Optional wafer rotation offers unique 2D/3D mapping to study wafer deformation as a function of temperature.
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Product
ESS Environment stress screening
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Temperature adaptability test under the condition of rapid change, or gradient for electrical, electronic, instruments and other products or spareparts, particularly applies to environmental stress screening test（ESS）
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Product
Highly Accelerated Stress Screening (HASS) Test
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HASS consists of high and low temperature and 3 axis vibration testing performed either individually or in combination.Highly accelerated stress screening is a technique for identifying process flaws in equipment during production. HASS subjects equipment to overstress conditions but at a level which does not affect design life.For assistance in designing a HASS test program contact the laboratory.
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Stress screening test chambers for temperature and climate
TS and CS series
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Our based on the modular concept of the standard range of temperature and climatic stress screening test chambers allow you through increased compressor and large fan performance very high temperature change of up to 30 K / min with conventional refrigeration, or to 70 K / min with liquid nitrogen. These devices allow you to very quickly determine the load limits of your test object in fast motion.
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Product
Mechanical Stress Card Testing
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Wheels are transversely positioned with micromechanical stopsPressure exercised on the card's chip and microcircuitryThe card is free to deform in the Z axisThe stress is controlled by an accurate, precise force sensorProgrammable number of cycles
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Product
Optical Receiver Stress Test Solution
N4917BSCB
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The Keysight N4917BSCB optical receiver test solution is a complete, automated and repeatable solution for optical receiver stress test.
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Product
Optical Fiber Cable Testing Equipment
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Optical fiber consists of a core and a cladding layer, selected for total internal reflection due to the difference in the refractive index between the two. In practical fibers, the cladding is usually coated with a layer of acrylate polymer or polyimide. This coating protects the fiber from damage but does not contribute to its optical waveguide properties. Individual coated fibers then have a tough resin buffer layer and/or core tube(s) extruded around them to form the cable core. Several layers of protective sheathing, depending on the application, are added to form the cable. Rigid fiber assemblies sometimes put light-absorbing ("dark") glass between the fibers, to prevent light that leaks out of one fiber from entering another. This reduces cross-talk between the fibers, or reduces flare in fiber bundle imaging applications Optical fibers are very strong, but the strength is drastically reduced by unavoidable microscopic surface flaws inherent in the manufacturing process. The initial fiber strength, as well as its change with time, must be considered relative to the stress imposed on the fiber during handling, cabling, and installation for a given set of environmental conditions. There are three basic scenarios that can lead to strength degradation and failure by inducing flaw growth: dynamic fatigue, static fatigues, and zero-stress aging.
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Product
Thermal Shock Testing
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Thermal shock is a very important test for determining the reliability of a product when subjected to sudden changes in temperature and how this stress source can accumulate deterioration or physical damage in performance.
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Product
Qualification and Quality Control Tests
Techsquare
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New IEC standards, IEC 60034-18-41 and IEC 60034-18-42, have been issued to define the procedures for testing partial discharge inception voltage and the long-term performance (endurance) of Type I and Type II insulation systems used in rotating machines fed from voltage converters. Voltage impulse generators are required at least to test turn insulation, but they would be recommended for any testing under power electronics supply because of their capability to simulate the real electrical stress conditions. More generally, any type of electrical insulation system when subject to impulsive voltage waveform during life should be carefully evaluated in terms of partial discharge and endurance behaviour. This is why voltage impulse generators able to provide impulses with controlled amplitude and frequency are needed to face this new testing challenge.
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Product
Shear Beam LoadCells
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Shear Beam LoadCells are designed for low profile scales and process applications. These loadcells should be mounted on a smooth flat surface using high strength hardend bolts. The mountaing holes are at the opposite end to where the cell is loaded. Some of the larger Shear Beam Loadcells use multiple mounting holes to allow extra bolts to hold them in place and keep them from stretching under the stress.
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Product
Mechanical Tester
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NANOVEA Mechanical Tester is the most versatile nanoindenter and scratch tester capable of precisely measuring the micro- to nanomechanical properties of wide ranges of materials from thin films, coatings, ceramics and composites to polymers and bio materials via Indentation, Scratch and Friction testing. All NANOVEA Mechanical Tester models come with true feedback load control from independent load and depth sensors that provide unmatched accuracy and the highest repeatability available on the market. This technology allows a user to perform Nanoindentation and Microindentation for Hardness and Elastic Modulus Testing, Stress vs Strain Analysis, Creep and Relaxation, Loss and Storage Modulus, Yield Strength and Fatigue, Fracture Toughness and Nano-scratch & Micro-scratch for Scratch Hardness Testing, Multi-pass Wear Test, Cohesive and Adhesive Failure Testing as well as Coefficient of Friction testing, all available on one system.
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Product
JD Edwards Load Testing
Dimension LoadTest
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Dimension LoadTest™ is a powerful yet easy to use load testing tool for JD Edwards EnterpriseOne applications. DWS have designed Dimension LoadTest such that any experienced System Administrator/CNC should be able to setup, create, run and monitor load tests to effectively stress test JD Edwards EnterpriseOne applications.
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Product
Resilient Modulus and Asphalt Testing System
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The Resilient Modulus software features built and test sequences, and the capability to specify user defined sequences. Contact stress is automatically adjusted according to the above procedures as selected. Available waveforms include haver sine, sine, square and triangular, along with a user defined waveform selection. Optional peak & valley compensation ensures proper and quick matching of the load parameters. Real time displays of the prescribed versus actual dynamic load or the dynamic deformation measurements by each sensor are always present. Deformation ratio of the two sensors, Rv (to ensure that the two deformation sensors are in agreement) and Mr are also calculated in real time. During export, curve fitting is done to fit the results to models that predict Mr as a function of σm, σd, and CP (cell pressure). Four different functions are calculated automatically
