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E-beam Metrology And Inspection
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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2-26.5 GHz Traveling Wave Amplifier
1GG7-8045
The 1GG7-8045 is a broadband GaAs MMIC Traveling Wave Amplifier designed for high output power and moderate gain over the full 2 to 26.5 GHz frequency range. Seven MESFET cascode stages provide a flat gain response, making the 1GG7-8045 an ideal wideband power block. Ebeam lithography is used to produce gate lengths of ~0.3 mm. The 1GG7-8045 incorporates advanced MBE technology, TiPtAu gate metallization, silicon nitride passivation, and polyimide for scratch protection.
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E-Beam Welded Through Hole Shunt Resistors
BWT
These space saving components feature E-Beam welded construction and full RoHS compliancy.
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Sputter Coater & Freeze Fracture Solutions
To obtain high-quality images of samples with scanning (SEM) or transmission electron microscopy (TEM), your samples need to be conductive to avoid charging. If a sample does not have a high enough conductivity, then you can quickly cover it with a conductive layer using the method of sputter coating. Also, a carbon or e-beam evaporator coating can be used. Such coatings protect the sample, allow enhancing of the EM image contrast, or can act as a TEM-grid support film for small scale samples.
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E-Beam Power Supplies
Maximize image quality and repeatability. Designed for scanning electron microscope tools, Advanced Energy’s precision e-beam technologies deliver impressive performance, accuracy, and reliability.
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Digital E-Gun Sweep
XYC-20
The XYC-20 E-beam evaporation controller is in a class by itself. The unit can be calibrated by the user to their specific system and e-gun. An algorithm determines the beam error from front to back and side to side within the pocket, eliminating pocket overshoot and burn-thru. The pattern control is effectively made linear saving time in programming and setup. Beam dwell time can vary at each location to compensate for variation in beam density. Six pocket sizes and two shapes can be selected.
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BSE Detection
SLIM
SLIM™ is an innovative design for under-the-column BSE detection.SLIM™ puts El-Mul’s ScintiFast™ together with a segmented, shaped light guide and Silicon Photomultipliers (SiPM) to create a fast, sensitive, segmented and compact BSE detector for e-beam tools.
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Photonic Components
Fraunhofer Institute for Telecommunications
The Department of Photonic Components is researching optochips and Photonic Integrated Circuits (PICs) for transmission and reception of more than 100 Gbit / s and the sensors. The department provides production and development services for all activitiesfor the German and international industry. If, for example, you already think of a particular optochip concept, the researchers offer additional advice and take over design and production steps. On the other hand, if you would like to start with a target specification, a feasibility study will begin and your own concept will be developed for you. Researchers are always ready and able to carry out initial production volumes in an ISO certified, qualified manufacturing facility. In addition, e-beam services and diffractive optical elements developed according to specifications are offered.
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Metrology & Inspection Systems
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Power Metering Precision Shunt Resistore
PMS
These components have E-Beam welded manganese-copper alloy elements giving high strength, stability and reliability. Low thermal EMF and TCR. Small size and minimal power loss. Minimal heat generation and surface temperature due to small total resistance. Proprietary processing technique allows very low resistance values. Ideally suited for KWh meters and sampling sensor shunts. These units are also suitable for custom design.
