Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
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Product
Ultrasonic Clamp-On Flow Sensor
SEMIFLOW CO.65
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SEMIFLOW CO.65 non-contact clamp-on flow sensors are ideal to measure abrasive, adherent, corrosive, and ultra-pure liquids on rigid plastic tubes and pipes used in the semiconductor industry. Equipped with an integrated electronic unit, they function as a complete flow meter in the size of a small transducer without an external board or transmitter.
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Product
DC Power Source Systems
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Looking for a proven, precise DC power source? Advanced Energy offers standard DC and pulsed-DC power-delivery options. Thanks to vast feature sets and reliable performance, our DC power generators are used in nearly every manufacturing market — semiconductor, flat panel, glass, thin film, etc. And via our global, dedicated support staff, we make sure you get the right DC power product for your processes and applications.
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Product
Semiconductor Test Software
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Easily create and run robust test programs in semiconductor automated test systems with ActivATE™ test management software. Designed by test engineers for test engineers, ActivATE™ tames automated test complexities with elegant simplicity.
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Product
Linear Positioning
KAOS OEM
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A speedy, slim positioning stage for two-axis applicationsBased on cog-free linear motors, KAOS two-axis positioning stages combine a differential-motion carriage and a primary carriage on a single rail. This patented design results in a fast, compact stage well suited to semiconductor, electronics assembly and pick-and-place applications.
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Product
GAS Testers
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Shenzhen Noyafa Electronic CO.,LTD
Noyafa GAS Tester uses high-quality semiconductor sensors, which can effectively eliminate interference and accurately obtain the concentration of formaldehyde, TVOC, etc. within the measurement range, accurate to the thousandth. With more than ten years of professional testing background, well-known big brands are more at ease and assured to use.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
PXI Switched Guard Reed Relay Module, 13x SPST
40-121-002
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The 40-121-002 provides 13x SPST switches in a single slot PXI module and designed to provide an isolation resistance in excess of 1013Ω. It has been designed to ensure high isolation resistance through the use of switched guards, making it ideal for low level measurements and semiconductor test.
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Product
Capacitor to Dampen
DAM2
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Lifasa - International Capacitors, SA
DAM switching capacitors are used to protect semiconductors (IGBT transistors). These are charged and discharged repeatedly with high current peaks.
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Product
FT-IR and FT-NIR Analyzers
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ABB capabilities encompass one of the largest portfolios in the world for laboratory, at-line and process FT-IR/FT-NIR analyzers. Founded in 1973, ABB Analytical Measurements (formerly Bomem Inc) designs, manufactures and markets high-performance, affordable FT-IR / FT-NIR spectrometers as well as turnkey analytical solutions for Petroleum, Chemical, Life Sciences, Semiconductor, Academic, Metallurgy, OEM industries and spectroradiometers for Remote Sensing/Aerospace market.
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
Surface Analysis
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Shimadzu offers a range of instruments that are ideal for all sample forms handled by customers in the fields of steel, non-ferrous metals, environment, foods, chemicals, pharmaceuticals, semiconductors, ceramics, and polymers. EPMA/SEM offers analysis of targets from several centimeters to several microns; XPS offers analysis from several millimeters to several microns; and SPM permits observations from over a hundred microns to several nanometers.
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Product
Edge Grinding Machines
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The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Product
SoC Test System
T2000
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SoC devices require small-lot high-mix manufacturing methods in the present era of rapid generation change. Semiconductor makers struggle with requirements to replace their testers on a 2-3 year cycle. The T2000 addresses their needs by enabling rapid response to market needs with minimum capital investment.
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Product
Probe Card Solutions
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Advanced engineering solutions are required to meet increasing challenges for wafer test, driven by today’s rapid technology acceleration. Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.
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Product
PMAC Controller CPU's
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PMAC Controllers are a family of high-performance motion control systems used in a wide range of applications, including machine tooling, semiconductor manufacturing, robotics, and scientific research.
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Product
MEMS Spring Probe
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MEMS Spring Probe is developed by NIDEC-READ original ultra-fine 3D processing technology and enables our customer to supply advanced and innovative test solutions at PCB & semiconductor testing market.
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Product
Probe Card
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Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
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Product
Amplifiers
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We have designed and manufactured amplifiers using all major semiconductor materials, LDMOS, GaN, GaAs, and InP, to produce narrow, wideband, and pulse, receive and transmit amplifiers from 1 MHz to 220 GHz and power levels from mW to over 10 kW.
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Product
Semiconductor
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The semiconductor industry faces continuous pressure to reduce device size and costs while improving performance and reliability. Semiconductor, test and assembly automation manufacturers demand the same improvements from the motion technology which drives it. Haydon Kerk Pittman continues to develop new technologies in motors, lead-screws, gears, encoders, actuators, slides, drives and complete sub-systems that increase operational speeds and accuracy while lowering the cost of ownership.
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Product
PXI 24 Channel High Voltage Multiplexer
40-320-101
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The 40-310/320 Range of High Voltage Switching Modules will hot switch up to 750V peak and cold switch up to 1000V peak in either general purpose relay (40-310) or multiplexer (40-320) configurations. These modules contain high-quality reed relays with switching ratings comfortably higher than the 40-310/320 specification. Applications for the 40-310/320 series modules include; circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing.
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Product
Scanning Electron Microscope
Verios G4 XHR SEM
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The Thermo Scientific™ Verios G4 scanning electron microscope (SEM) provides sub-nanometer resolution from 1 to 30 kV and enhanced contrast needed for precise measurements on materials in advanced semiconductor manufacturing and materials science applications, without compromising the high throughput, analytical capabilities, sample flexibility and ease of traditional Scanning Electron Microscope (SEM).
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Product
EMBEDDED MMC (EMMC)
SD 3.0 / eMMC 4.51 IP Family
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The eMMC Host IP is an RTL design in Verilog that implements an MMC / eMMC host controller in an ASIC or FPGA. The core includes RTL code, test scripts and a test environment for full simulation verifications. The Arasan MMC / eMMC Host IP Core has been widely used in different MMC applications by major semiconductor vendors with proven silicon.
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Product
PXI-2535, 544-Crosspoint, 1-Wire PXI Matrix Switch Module
778572-35
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544-Crosspoint, 1-Wire PXI Matrix Switch Module—The PXI‑2535 is a high-density 4x136 PXI matrix switch module that is ideal for routing low-power DC signals in validation test systems of mass produced devices such as semiconductor chips and printed circuit boards (PCBs). Featuring field-effect transistor (FET) relays, the PXI‑2535 offers unlimited mechanical lifetime and switching speeds up to 50,000 crosspoints/s. It also features onboard relay counting for relay monitoring and deterministic operation with hardware triggers to improve test throughput.
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Product
Atomic Force Microscope
AFM
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Atomic Force Microscopes are the most widely used SPM microscopes. They can be applied in fields that span from surface science, semiconductor technology, magnetic media, polymer science, optics to biology, chemistry and medicine.Absolute positioning with an accuracy of 2 nm.
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Product
µHELIX® Test Probes
Series S200, S300, S400, and S500
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Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Product
Semiconductor Packaging System
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Inspects the quality of finished cells by measuring the gap between the battery electrode laminate and aluminum can.
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Product
Photodiodes
Avalanche
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Similar to photomultipliers, avalanche photodiodes are used to detect extremely weak light intensities. Si APDs are used in the wavelength range from 250 to 1100 nm, and InGaAs is used as semiconductor material in APDs for the wavelength range from 1100 to 1700 nm.
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Product
PXI-5154, 1 GHz, 2 GS/s, 8-Bit, 256 MB/ch, PXI Oscilloscope
780319-03
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1 GHz, 2 GS/s, 8-Bit, 256 MB/ch, PXI Oscilloscope—The PXI‑5154 is ideal for acquisition and characterization of fast, nanosecond-edge speeds. It is well-suited for automated test and data streaming applications in the consumer electronics, semiconductor, aerospace/defense, and life sciences industries. The PXI‑5154 also comes equipped with up to 256 MB of memory per channel to provide high, sustained sample rates over extended data capture windows. This digitizer, optimized for automated test, uses a high-throughput bus to lower test times, provides picosecond-level synchronization among modules, and integrates with the entire suite of NI hardware, so you can build and customize a complete mixed-signal or high‑channel‑count test system.
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Product
Test System Optimized for High Throughput, Low Cost of Test for Single Site, Multi-site and Index Parallel Applications
ETS-88RF
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Targeting the needs of power amplifier (PA) and front-end-module (FEM) semiconductor manufacturers, the ETS-88RF test system is aligned with the test challenges associated with these direct RF radio wave interface components. The precision with which the ETS-88RF can measure high-gain, wideband frequency performance, adjacent channel leakage and power supply efficiency makes this test system the most cost-effective alternative to bench set-ups. Teradyne routinely provides timely updates to a substantial library of RF Standards (such as 802.11xx and 3GPP) targeted for PA and FEM test.
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Product
Semiconductor Test Equipment
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Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
