Particle Size
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Product
Particle Deposition Systems
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MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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Product
Pocket Sized Dial Thermometer w/ 5 Inch Stem
T160/3
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UEi Test & Measurement Instruments
Farenheit scale thermometer with 1 3/4 inch dial and 5 inch stem with a -40˚ to 160˚F range
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Product
Handheld Particle Counters
Models 3888 And 3889
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Kanomax’s innovative Handheld Particle Counters (Models 3888 & 3889) set the standard of instrumentation in cleanroom / operating room monitoring and verification, filter testing, IAQ investigation, data center cleaning and many more highly specialized and highly sensitive applications. These beautifully engineered devices boast some of the most highly advanced technology in the industry. A combination of accuracy and practicality, these devices count airborne particles with high quality performance.
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Product
Single CMC size PCI Mezzanine Card
PMC SyncClock32
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Brandywine Communication’s model PMC-SyncClock32 is a compact PCI Mezzanine Card (PMC) that precisely synchronizes the time on VME cards or provide accurate GPS synchronized time to the host motherboard. The 32-bit interface provides time from microseconds through years.
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Product
SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
Computer on Module
The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.
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Product
COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
Computer on Module
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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Product
Particle Solutions
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Brookhaven Instruments Corporation
ultimodal Size Distribution which has been refined to give a more accurate graphical image of the particles being measuredHealth Mode post-measurement analysis for DLS, ELS, and PALSStatistical Process Control seamlessly integratedParticle Solutions 3.2, a robust suite of software that integrates five measuring technologies in one package: DLS, ELS, PALS, ASEC and Rhe.
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Product
PXI-6115, 4 AI (12-Bit, 10 MS/s/ch), Buffer Size 32MS, 2 AO, 8 DIO, PXI Multifunction I/O Module
778204-01
Multifunction I/O
4 AI (12-Bit, 10 MS/s/ch), 2 AO, 8 DIO, PXI Multifunction I/O Module - The PXI‑6115 is a simultaneous sampling, multifunction DAQ device. It offers analog I/O, digital I/O, two 24‑bit counters, and digital triggering. It is ideal for a variety of applications, such as stimulus/response applications where synchronization among analog input, analog output, and digital I/O is required, 42 V automotive applications, radar, sonar, and ultrasound. The included NI‑DAQmx driver and configuration utility simplify configuration and measurements.
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Product
Particle Impact Noise Detection (PIND) Test
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This test detects the presence of free moving particulate contaminants within sealed cavity devices. This test is specifically directed toward relays and other devices where internal mechanism noise makes rejection exclusively by threshold level impractical. This test method also may be used prior to final sealing in the manufacturing sequence as a means of eliminating loose particles from the interior of the device.
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Product
COM-HPC Server Type Size E Reference Development Platform based on Ampere® Altra® SoC
Ampere Altra Developer Platform
Software Development Kit
Backed by a broad Arm® ecosystem with an Ampere® Altra® SoC at its core, using the Arm® Neoverse™ N1 platform, the Ampere Altra Developer Platform provides premium performance from a cloud-to-edge infrastructure, keeps an extremely low thermal envelope, lower TCO, and significantly lower power consumption than x86 designs. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Product
Chassis Slide Rail Size 7
65-053
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Automatic release in extended position. The chassis/cabinet mounted slide rails are ultra rugged and hold significantly more weight and can withstand shock and vibration in harsh environments.
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Product
Cryogenic Mill for Sample Sizes 0.1 - 100 Grams
Cryogenic Gringer 6870
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Large cryogenic mill that accommodates sample sizes ranging from 0.1 - 50 grams. Specifically designed for cryogenic grinding and pulverizing tough and/or temperature sensitive samples immersed in liquid nitrogen. CE Approved.
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Product
Power/Position/Size Sensors
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Thermal sensors that measure laser power and single shot energy like standard thermal sensors but in addition measure laser beam position and laser size. This position sensing detector measures laser beam position to 0.1 mm accuracy and laser size measurement of a Gaussian beam to +/-5% accuracy. Measuring laser position is important for laser alignment where the laser position sensor can provide feedback to the laser position control.
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Product
Pocket Sized Dial Thermometer w/ 5 Inch Stem
T160
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UEi Test & Measurement Instruments
Farenheit scale thermometer with 1 inch dial and 5 inch stem with a -40˚ to 160˚F range
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Product
Palm Size Digital Multimeter, Calibrated, 1999 Count, Mean Value, Manual Range, 3.5 Digit
72-7770 CAL DU
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The 72-7770 CAL DU from Tenma is a palm sized digital multimeter with 3 3/4 digit LCD. It is 3 1/2digits with steady operations, fashionable design and highly reliable hand held measuring instrument. The meter measures AC/DC voltage, AC/DC current, resistance, temperature, diode and continuity. It is an ideal tool for maintenance. The multimeter features square wave output, data hold, low battery indicator and display backlight, This meter complies with the standards CE, IEC61010, in pollution degree 2, overvoltage category (CAT I 600V, CAT II 300V) and double insulation.
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Product
COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
Computer on Module
ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
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Product
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
Computer on Module
ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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Product
SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
LEC-BTS
Computer on Module
- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip- Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)- HDMI and LVDS- GbE, camera interface- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO- Extreme Rugged™ operating temperature: -40°C to +85°C
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
Small size non-steady-state probe for thermal conductivity measurement
TP08
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Hukseflux Thermal Sensors B.V.
TP08 is a probe that offers the possibility to perform a practical and fast measurement of the thermal conductivity (or thermal resistivity) of the medium in which it is inserted at a high accuracy level. It works in compliance with the ASTM D 5334-00, D 5930-97 and IEEE 442-1981 standards. The TP08 is a small version of type TP02, made for situations where the length of the TP02 poses a problem. The standard TP08 probe has proven its suitability for soils, thermal backfill materials, sediments, foodstuff, powders, sludges, paints, glues and various other materials.
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Product
Large Size RF Test Enclosure, ≥100 DB Isolation, 300 MHz - 18 GHz
dbSAFE MAX
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Some applications require larger test environments. The dbSAFE MAX blends all the superior isolation characteristics of the standard dbSAFE DUO shielded box into a larger volume to guarantee you get better results.
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Product
Fineness of Grind Gauges
2020
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The Elcometer 2020 Fineness of Grind Gauges is used to determine the particle size and fineness of grind of many materials including paints, pigments, inks, coatings, chocolates and other similar products.
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Product
Large Cryogenic Mill that Accomodates Sample Sizes from 0.1 to 100 Grams
Shaqer 1500
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The ShaQer™ offers high throughput and improved pesticide extraction for QuEChERS Sample Prep! It agitates up to six samples simultaneously compared to just two samples processed by hand. The vigorous clamp movement results in thorough extraction of pesticide residue in fruit and vegetables. Every sample is handled in the same manner ensuring consistency and eliminating variations that can occur in manual sample prep. It also accommodates a variety of tube sizes and shapes. CE Approved.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
Computer on Module
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Product
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
Computer on Module
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
Computer on Module
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Product
Handheld Emission Particle Counter
HEPAC
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Naneos Particle Solutions gmbh
Exhaust gas contains a lot of humidity, which can condense in the measuring device when the gas cools down. This could lead to problems with the measurement. Therefore, corresponding sensors are heated or the gas gets previously diluted. Exhaust gases from petrol and natural gas vehicles, however, contain a lot more humidity, which is why the device should only be used for diesel exhaust gases.
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Product
COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
