SPI
assures volume and area of paste application.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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USB-8451, 250 kHz I2C, 12 MHz SPI I2C/SPI Interface Device
779553-50
The NI USB‑8451 is a master interface for connecting to and communicating with inter-integrated circuit (I2C), System Management Bus (SMBus), and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8451 is a portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices or toggling LEDs. The USB‑8451 can be physically located more closely to I2C/SPI devices than PCI interfaces, reducing I2C bus length and minimizing noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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I2C/SPI Exerciser and Protocol Analyzer
PGY-I2C/SPI-EX-PD
Prodigy Technovations Pvt. Ltd.
I2C Protocol Analyzer and SPI Protocol Analyzer (PGY-I2C/SPI-EX-PD) are the Protocol Analyzers with multiple features to capture and debug communication between host and design under test. PGY-I2C/SPI-EX-PD is the leading instrument that enables the design and test engineers to test the respective I2C or SPI designs for its specifications by configuring the PGY-I2C/SPI-EX-PD as Master/Slave, generating I2C/SPI traffic and decoding the I2C/SPI protocol decode packets
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USB Logic Analyzer- High Speed Data Logger -SPI / IC Analyzer
LOG Storm
Logic analyzers are key tools for that process – they offer visibility over what happens in your digital electronic system.
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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TTL/I2C/SPI* Expansion Kit
OP-SB5GL
OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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Process Improvement Software for SPI & AOI
SIGMA Link
SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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8-Sites ISP & I2C/SPI Interface
YAV90ISP
Industrial Programmers Interface up to 8 targetsRelay BarrierDemultiplexer module up to 32 devicesCommunication Interfaces I2C and SPI
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I²C/SPI Interface Device
The I²C/SPI Interface Device is a master or slave interface for inter-integrated circuit (I²C), or master interface for serial parallel interface (SPI) devices. With plug-and-play USB connectivity, the I²C/SPI Interface Device is a portable solution to communicate with consumer electronics and integrated circuits. The I²C/SPI Interface Device can be physically located more closely to I²C/SPI devices than PCI interfaces, reducing I²C bus length and minimizing noise problems. The I²C/SPI Interface Device supports I²C rates up to 250 kHz and SPI rates up to 50 MHz, and it also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I²C devices or toggling LEDs.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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SPI | AOI | AXI
Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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AOI & SPI Test Systems
To keep the quality of your production at its best you need a good inspection of your boards. For efficient and detailed in-depth board inspection ensure you have SMT inspection equipment that meets your needs. Our AOI & SPI units will provide the quality you need for reliable inspection of soldering inspection.
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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High-Speed Multi-IO SPI Host Adapter
BusPro-S™
The BusPro-S High-Speed Multi-IO SPI Host is designed with speed, versatility, and value in mind. Featuring a 60 MHz clock rate with up to 200 Mb/s throughput and support for standard, dual, quad, and 3-wire modes, the BusPro-S is the right tool for all SPI debugging applications-present and beyond.
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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SPI Isolators
SPI (Serial peripheral interface) is one of the most widely used interfaces between microcontrollers and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. Analog Devices has your isolated SPI bus covered with our dedicated SPI digital isolators which support this synchronous, full duplex master-slave-based interface. Options include devices built with ADI's proven iCoupler® technology and offering a small footprint, simple design-in, fast speeds, and high data integrity, as well as integrated µModules which require no external components. Our SPI isolator solutions increase performance and reduce board space. This simple, compact solution is ideal for isolated SPI data requiring communication across different ground potentials or through large common mode transients often found in Industrial PLCs (programmable logic controllers) and Instrumentation and data acquisition systems.
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Universal Relay Driver Control - PXIe, 32 Channel Direct Relay Drivers
33011
PXI-e based universal relay control for semiconductor load boards, 32CH direct relay drivers, 2 lanes of SPI relay control interface
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Gas Flow Sensors
ESRF-ESF Sensor
ESRF-ESF is one of the few gas flow sensors featuring bidirectional gas flow sensing of up to ±300 ln/min with a total error band of < 1.25% RD. ESRF-ESF gas flow sensors provide calibrated and temperature compensated output on an SPI, I2C bus or analog output making them plug & play for direct interfacing to low voltage MCUs and systems. The user is provided with a multitude of interface and output options so that the right sensor configuration can be selected based on the specific requirements for each application.
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Transceiver
TCVR Series
*4-wire SPI (3.3 V Logic) digital interface *-45 C° to +85 C° *4 W linear power T*ransceiver pair support dual polarization *Low EVM% *Outdoor unit IP68 compliant *Compliant to RTCA-DO-160G *Concept/Eval Unit Tested to 1024-QAM
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SparkFun Triple Axis Accelerometer Breakout
ADXL362
We've been using and selling Analog Devices' ADXL accelerometers for a good while now, and now we've found another great part in the series! The ADXL362 is a complete 3-axis MEMS acceleration measurement system that operates at extremely low power consumption levels. It measures both dynamic acceleration, resulting from motion or shock, and static acceleration, such as tilt. It's easy to communicate with the ADXL362 over SPI and built-in digital logic even enables autonomous operation for "wake-on-shake" operation.
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Multipurpose Debug Board For EC
DB30 x86 Debug Module
The DB30 x86 Debug Card is designed for debugging of COM Express modules with FFC (FlexFoil Cable) debug connector. It includes an 80 port for Power on and Self-test (POST) via I2C interface, interface to SPI Flash for BIOS update, interface to EC for Embedded Controller (EC) update, Power and Reset buttons, and Status LEDs and Test Point for various debug tests.
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Low Speed Protocol Decode/Trigger Software (I2C, SPI, RS232, I2S, JTAG)
D9010LSSP
This bundle includes powerful decoding and triggering for the following serial bus standards: I²C, SPI, Quad SPI, eSPI (including Quad eSPI), RS232/UART, Manchester, I²S, SVID, and JTAG (IEEE 1149.1). It is compatible with S-Series, V-Series, Z-Series, EXR-Series, MXR-Series, UXR-Series, 9000 Series, and 90000 Series Infiniium oscilloscopes. For detailed information on the decode and trigger settings, please refer to the datasheet.
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Xilinx Zynq ARM + FPGA SoM
TE0715-7015
Sundance Multiprocessor Technology Ltd.
TE0715s are industrial-grade Xilinx Zynq-7000 System on Modules with 4 MGT Links , a gigabit Ethernet transceiver, 8 Gbit (1 Gbyte) DDR3 SDRAM with 32-bit width, 32 Mbyte SPI Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips.
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High Flexibility Test Controller Card
TCC 1800-UE
The TCC1800-UE Test Controller Card is a generic control board for production testing of printed circuit boards (PCBs). The board is controlled by a command language on a PC to which it is connected via Ethernet.The TCC1800-UE is designed to work with positive voltages up to 24V. The card provides extensive IO: Analog and digital interfacing, counters, PWM outputs, bidirectional I/O, ethernet-, CAN, USB, SPI and I2C interfacing.
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Voltage Output D/A Converters
Analog Devices offers a large family of resistor string and R-2R voltage output (VOUT) D/A converters (DACs). From 8 bits up to 20 bits of resolution, single to 40 channels, integrated or external reference, parallel, LVDS, serial SPI or I2C interface, with high temperature operation, we have a D/A converter to suit your application. We provide precision, buffered, and unbuffered rail-to-rail VOUT D/A converters with up to ±1 LSB INL and DNL specifications and excellent offset and gain error. Our D/A converters work well in a wide variety of open-loop or closed-loop systems—adjusting gain, offset, and many other signals.
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Accelerometor, Gyro, Magnetometer Breakout Board
SEN-38001
The LSM9DS1 is a highly configurable, flexible and precise motion sensing solution from ST Microelectronics - the latest in a wide-ranging inertial product line. It integrates a 3-axis accelerometer, 3-axis gyroscope and 3-axis magnetometer into a single IC , giving you a full nine degrees of freedom (9-DOF) in a tiny 3mm x 3.5mm package. Even with support components, square mounting pattern and connection breakouts for both SPI and I2C, this board is barely the size of a quarter.
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IO60-DIO48 Module
IO60-DIO48
WINSYSTEMS’ IO60-DIO48 Module adds GPIO to embedded systems with IO60 expansion featuring 48 GPIO (General Purpose Input-Output) tolerant to 30 V DC. The SPI interface is implemented through the MACH XO2 SPI-slave EFB (Embedded Function Block) interface. Each bit of each port is implemented as a bi-directional tristate driver. Each bit of each port can also be configured and enabled to detect rising and/or falling edge events and generate a system interrupt.
