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3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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3D Solder Paste Inspection system
PI Series
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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3D Inline Solder Paste Inspection System
TROI 7700 SERIES
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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3D Inspection Software
Metrolog X4
Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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3D Measurement And Inspection
LOTOS
LOTOS automatic measuring systems can measure the full outer contours or individual areas of any measurement object quickly and precisely, irrespective of the shape, and test them for imperfections. The three-dimensional, non-contact measurement is carried out using optical measurement sensors with accuracy in the μm range. The result is a representation of the measurement object as a 3D model. Powerful, intuitive software allows the measurement results to be assessed extremely quickly.
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3D Bead Inspection
Increasing demands for product quality and, as a result, high-quality adhesive bonds are becoming ever more important in the automotive industry. With RTVision.3d from QUISS, it is now possible not only to measure the width, position, and continuity of the bead application but also its height. This provides insights into the applied material volume.
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3D Inspection Service
The reference data may come in the form of a table, with values at specific points or features, a cad model, or 3d scan. 3D inspection services may require datum measurements, where the part to be inspected is located in a fixture that is specifically designed to orient the part by an ordered method. In some cases, the part may have features that are designed specifically to be referenced by datums, if no functional feature of the part provides a clear reference.
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Solder Paste Printers
Shenzhen Leadsmt Technology Co.,Ltd
Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.
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Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Solderability Tester
LBT210
Microtronic Microelectronic Vertriebs GmbH
Microtronic's LBT-210 solderability tester has software that offers statistical information such as mean value, standard deviation, etc. A camera option offers video of the test cycle and storage in memory with the appropriate test measurements and data. Additionally, it has the feature to test under nitrogen. This function can be switched on in the software. An enclosure that is flooded with nitrogen lowers and rises with the device under test.
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3D Antennas
A 3D capable printing technology designed to create printed electronics directly on 3D surfaces using modern software controlled digital process.
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3D Sensors
*Up to 38500 distance values per measurement for a detailed assessment of the application*Configurable outputs*Visual assessment of distance, level or volume*Predefined function blocks*Time-of-flight measurement principle
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GENERAL INSPECTION MACHINE AFTER SOLDER MASK
DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
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Simple 3D Measurement & Inspection
XG-X Series Vision System
Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
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Soldering Station
SM-898D
*Using micro-processor PID program control technology, precise dual digital display hot air gun and the stability of the actual temperature of the soldering iron, fast automatic temperature compensation feature further enhanced temperatures.*The amount of wind, air flow, temperature soldering iron are adjustable.*The air gun holder is a magnetron (or light control), holding the handle when the system will automatically enter the working mode; handle is placed on the shelf when the system enters standby mode automatically.(One more than the 898D Auto Sleep off function)*System with automatic cold wind function, can prolong the life of the heating element.*This product uses "brushless fan" as a source of air, reduce noise, improve work efficiency
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3D Automated Optical Inspection Systems
New 3Di Series
To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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Inspection System for high-power precise 3D X-ray CT
X-eye PCT225
Inspection System for 3D X-ray CT able to analyze defected area precisely by precise movement of axis with high polished Anti-vibration table. High-power X-ray Tube of max. 450kV and large area Flat Panel Detector of max.16 inches can be installed depending on the sample. Customized 3D CT equipment is available with selecting main parts by customers depends on their needs for size and material.
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3D Scanner
Artec Space Spider
A new and enhanced precision instrument for CAD users and engineers, Artec Space Spider is a high-resolution 3D scanner based on blue light technology. It is perfect for capturing small objects or intricate details of large industrial objects in high resolution, with steadfast accuracy and brilliant color. The scanner’s ability to render complex geometry, sharp edges and thin ribs sets our technology apart. It is an ideal industrial 3D scanner for high resolution capturing of objects such as molding parts, PCBs, keys, coins or even a human ear, followed by the export of the final 3D model to CAD software.
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3D Measurement
PSD-Array
The PSD array consists of 16 parallel one-dimensional PSD elements on the same chip. By utilizing the triangulation technique the reflection of a laser line or multiple laser spots onto the PSD array will provide information about the contour of the illuminated object. The possibility for simultaneous readout of the 16 elements together with the fast response of each element makes the PSD array suitable for applications like high speed 3D contour measurements and measurements of parallel, moving objects such as cantilevers.
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3D AOI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
