Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
-
product
High-Temperature SOIC DIP Adaptor
SERIES 35000-10-HT
High Temperature Lead Free SOIC DIP Adapters. A cost effective means of upgrading to SOIC...without changing your PCB layout. Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers.
-
product
24-Pin SOIC w/Package-to-22-Pin 0.400" DIP
22-304504-18
24Pin SOIC w/ Package to 22 Pin .4 DIP. A cost effective means of upgrading to SOIC without changing your PCB layout.
-
product
Lock/Eject DIP Collet Socket with Surface Mount Pins
EJECT-A-DIP
Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
-
product
DIP-to-SOIC Adaptor
Series 354000
DIP to SOIC Adapters. Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts.
-
product
Universal SOIC-to-0.600 [15.24] DIP Adaptor
Series 647
Universal SOIC to .600 [15.24] DIP Adapter. 44 pin adapter for mounting Aries Series 547 Universal SOIC ZIF (zero insertion force) Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.
-
product
QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adaptor
96-208M50
QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
-
product
PLCC-to-DIP Adaptor
1109342
PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors. Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors.
-
product
SOIC DW-to-20-Pin PLCC
MC145158-2
ADAPTER FOR MOTOROLA. FROM PLCC 20 PIN FN PACKAGE TO SOIC DW PACKAGE. A cost effective means of upgrading to SOJ or SOIC ... without changing your PCB layout.
-
product
TSOP-to-DIP (0.600 [15.24]) Adaptor
655000
TSOP to .600 [15.24] DIP Adapter. Designed to allow user to cut 32 position adapter down to any size desired. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
-
product
Male/Female DIP Jumpers
Series 200 thru 216
Male/Femaie DIP Jumpers. Reliable, electronically tested solder connections. Protective covers are ultrasonically welded on and provide strain relief for cables. 10-color cable allows for easy identification and tracing.
-
product
DIP-to-JEDEC TO Adaptor Socket
1109522 & 1109523
DIP to TO Adapter Sockets. 8 pin DIP IC socket on the top and a circular, 8 pin TO can male pin footprint on the bottom. ICs now available only in 8 pin DIPs can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
-
product
Deci-Center™ Jumpers
SERIES 150/151
DECI-CENTER JUMPERS. Pitch bars help maintain .100 [2.54] conductor spacing.Consult factory for jumper lengths under the specified minimum length.
-
product
DIP Adaptor
48Pin .5mm QFP to 48Pin .6 Dip Adapter. Makes 48 pin QFP prototype circuits with a standard bread board easy.
-
product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
-
product
Lo-PRO®file Collet Socket with Solder Tail Pins
Series 513
LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options
