Teledyne DALSA
DALSA Corporation is an international high performance semiconductor and electronics company that designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized wafer foundry services.
- 519 886 6000
- 519 886 8023
- sales.americas@dalsa.com
- 605 McMurray Road
Suite 142
Waterloo, Ontario N2V 2E9
Canada
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Product
Infrared Detectors
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Powerful, versatile uncooled long-wave infrared solutions for industrial, security and defense applications offered by Teledyne DALSA.
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Product
Area Scan Camera
Genie Nano-CXP
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Introducing Genie Nano-CXP, a camera designed for full-throttle performance. Genie Nano-CXP builds on Nano's proven, industry leading reputation and leverages a CoaXPress 6Gbps interface to deliver the maximum throughput from leading edge high resolution CMOS image sensors.
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Product
Area Scan Camera
Genie Nano-5GigE
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Engineered for imaging applications that require high-speed data transfer, the all new Genie Nano 5GigE is an easy replacement for gigabit ethernet cameras built into current vision systems that rely on the existing GigE Vision interface standard. The new Genie Nano 5GigE models feature the brand new 5Gbps (5GBASE-T) link speed.
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Product
Line Scan Camera
Linea Lite
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Linea Lite makes line scan more accessible than ever. Designed with performance in mind, this camera offers superior color fidelity with 2k to 4k resolution and line rates from 12.5 to 50 kHz, with a GigE Vision® interface.
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Product
CCD Foundry Services
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Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Product
Multi-Interface Frame Grabber
Xtium2 CLHS FX8 LC
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The Xtium2-CLHS FX8 LC supports up to two bidirectional SPF+ modules running at 10Gbit/s. Using CLHS X-Protocol, the Xtium2-CLHS FX8 delivers up to 2.0 GB/s of image acquisition and 6.8 GB/s to host memory. The low-cost SPF+ module and fiber optic cables help extend cable lengths to 100 meters.
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Product
Line Scan Camera
Linea SWIR
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Teledyne DALSA’s short-wave infrared (SWIR) GigE line scan camera features a cutting-edge InGaAs sensor in a compact package for a wide variety of machine vision applications.This high speed, high resolution camera is the first product in DALSA’s SWIR family. Linea SWIR features a cutting-edge InGaAs sensor in a compact package that is suitable for a wide variety of applications. With exceptional responsivity and low noise, this camera allows customers to see their products like never before. Linea SWIR is available as a 1k resolution camera with highly responsive 12.5 µm pixels, or a 512 resolution camera with larger 25 µm pixels
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Product
Long Wave Infrared Cameras
Calibir DXM640 Series
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The Calibir uncooled Long Wave Infrared camera platform offers outstanding shutterless imaging performance and is optimized for Size, Weight and Power (SWAP). The Calibir DXM640 series features both shutter and shutterless operation and rapid image output on power up while delivering uniform response over the entire operating temperature range, making it ideal for thermal imaging applications requiring uninterrupted image acquisition. ULIS’s gen2 sensor offers an improved NETD and the updated calibration include customized gain correction on a per lens basis to offer even better image performances and response uniformity.
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Product
CL MX4 Frame Grabber
Xtium-CL MX4
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Building on the field proven capability of Teledyne DALSA’s Xcelera frame grabber series, the Xtium™-CL MX4 is based on industry standard PCI Express™ Gen 2.0 expansion bus to deliver high speed access to host memory. The new Xtium series offers higher bandwidth to sustain Camera Link® 80-Bit modes over longer cable distances and supports a wide variety of area and line scan color/monochrome cameras, all in a compact, half-length, single slot solution.
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Product
CL PX4 Dual Frame Grabber
Xcelera-CL PX4 Dual
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Building on the field proven technology and performance of Teledyne DALSA’s X64 frame grabbers the new Xcelera Series leverages the PCI Express (PCIe) platform to bring traditional image acquisition and processing technology to new levels of performance and flexibility. The PCIe host interface is a point to point host interface allowing simultaneous image acquisition and transfer without loading the system bus and involving little intervention from the host CPU. The X64 Xcelera-CL PX4 Dual is a highly versatile PCIe frame grabber capable of acquiring images from two independent Camera Link™ Base cameras and performing image transfers at rates up to 1024MB/s. Its low cost, combined with its ability to support multiple tap configurations from area and linescan monochrome/RGB cameras simultaneously; in addition to its onboard FPGA Bayer decoding and real-time shading correction makes the X64 Xcelera-CL PX4 Dual an ideal solution to a wide variety cost-sensitive applications.
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Product
Line Scan Camera
Linea ML
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The Linea ML brings leading edge CMOS technology that is faster than ever, with affordable multiline architecture that enables the newest, most powerful inspection techniques including HDR, color and multispectral analysis, and multi-field imaging (single-pass bright/darkfield). With a native fiber optic interface for easy, low-cost long cabling, the Linea ML opens new horizons in inspection.
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Product
Mixed-Signal Design
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Teledyne DALSA’s mixed-signal group, formerly known as Axiom IC, delivers high-performance, high-quality data-converter designs and IP blocks for the industrial, professional, scientific, imaging and audio markets. Based in the Kennispark business and science park in Enschede, The Netherlands, the group works in close cooperation with the University of Twente and supports PhD students and trainees to stay involved in the newest CMOS design methodologies and technologies.
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Product
Frame Grabbers
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Teledyne DALSA delivers the industry's most reliable and versatile family of frame grabbers combining industry leading performance with industry leading feature sets, great value and extensive camera support. Board-level innovations deliver Trigger-to-Image Reliability significantly increasing system performance and ultimately helping to increase yield, while CamExpert, the camera configuration utility included with our free Sapera LT SDK, leverages the power of our acquisition boards in one of the industry's most efficient and easy to use interfaces.
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Product
CL PX4 SE Frame Grabber
Xcelera-CL PX4 SE
Frame Grabber
The X64 Xcelera-CL PX4 SE is a highly versatile PCIe frame grabber capable for one Camera Link™ Base, Medium, or Full camera and performing image transfers at rates up to 1024MB/s. Its low cost, combined with its ability to support multiple tap configurations from area and linescan monochrome/RGB cameras simultaneously; in addition to its onboard FPGA Bayer decoding and real-time shading correction makes the X64 Xcelera-CL PX4 SE an ideal solution to a wide variety of cost-sensitive applications.
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Product
Xtium2 Frame Grabber Family
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The Xtium2 series leverages the PCIe Gen3 x8 platform to deliver high- speed image transfers to host memory without CPU overhead. Featuring Camera Link HS® interface standards, supports Active Optic Cable and SFP+ modules, CoaXpress® 12, and Camera Link®.





































































