Scientific Computing International
Not a manufacturer of consumer goods, but rather a developer and provider of advanced metrology systems and analysis software.
- (760) 634-3822
- info@sci-soft.com
- 6355 Corte Del Abeto
Suite C-105
Carlsbad,, CA 92011
United States of America
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Micro-spot Spectroscopic Reflectometry
FilmTek 2000M
Scientific Computing International
Micro-spot size benchtop metrology system engineered for unparalleled versatility and high performance, meeting the needs of patterned film applications requiring a very small spot size. Allows for measurement spot sizes as small as 2µm, and delivers reliable measurement of both thin and thick films.
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Photonics & Telecom
Scientific Computing International
photonic integrated circuit manufacturing delivers unmatched measurement accuracy.
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R&D
Scientific Computing International
A term to describe the effort a company devotes to the innovation, and improvement of its products and processes.
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Semiconductor
Scientific Computing International
Materials which have a conductivity between conductors (generally metals) and nonconductors or insulators
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Optical Thin-Film Metrology for Advanced Thin Films
FilmTek 6000 PAR-SE
Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
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Micro-spot DUV Reflection and Transmission Spectrophotometry
FilmTek 3000 PAR
Scientific Computing International
Metrology system with a 50µm spot that delivers high-performance transmission and reflection measurement of patterned films deposited on transparent substrates. Ideally suited for measuring the thickness and optical constants of very thin absorbing films.
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Flat Panel Display
Scientific Computing International
Is an electronic display used to display visual content such as text or images.
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Thin Film Design Software
Scientific Computing International
SCI offers software tools for optical thin film design, material analysis, ellipsometry, and spectrophotometry. SCI’s current standalone optical thin film software includes:
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Solar Photovoltaic
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film.
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CD Measurement and Advanced Film Analysis
FilmTek CD
Scientific Computing International
SCI’s leading-edge solution for fully-automated, high-throughput CD measurement and advanced film analysis for the 1x nm design node and beyond. Delivers real-time multi-layer stack characterization and CD measurement simultaneously, for both known and completely unknown structures. Patented multimodal measurement technology meets the challenging demands associated with the most complex semiconductor design features in development and production.
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Compound Semiconductor
Scientific Computing International
Semiconductors that are made from two or more elements.
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Data Storage
Scientific Computing International
Refers to magnetic, optical or mechanical media that records and preserves digital information for ongoing or future operations.
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Multiple Angle Reflectometry
FilmTek 4000
Scientific Computing International
Fully-automated wafer metrology optimized for photonic integrated circuit manufacturing. Delivers unmatched measurement accuracy, with a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems. Designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.
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Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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Advanced Packaging & TSV
FilmTek 2000M TSV
Scientific Computing International
Advanced semiconductor packaging metrology system providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL) and other packaging processes.
