Evans Analytical Group®
EAG's Microelectronics Test and Engineering lab network provides IC design firms worldwide with unmatched excellence in vertically integrated engineering services and support from the early chip design stage to volume production. We actively service thousands of distinct semiconductor firms worldwide each year giving us an unparalleled knowledge-base from which to help you design, develop, test, analyze, and debug even your most challenging projects.
- 408 454 4600
- 408 588 0051
- info.mte@eag.com
- 2710 Walsh Ave.
Santa Clara, CA 95051
United States of America
Categories
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X-ray Fluorescence, XRF Analysis Services
Two XRF systems are available, a wavelength dispersive system (WDXRF) and an energy dispersive system (EDXRF). The difference is the manner in which the x-rays are detected. WDXRF instruments have very good energy resolution which leads to fewer spectral overlaps and improved background intensities. EDXRF instruments have higher signal throughput which can shorten analysis times. The higher signal throughput also makes EDXRF systems suitable for small spot or mapping analysis.
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Surface Analysis and Materials Characterization Services
The Materials Characterization division of Evans Analytical Group is the leading global provider of surface analysis and materials characterization services. Our international network delivers world-class analytical services directly to you. EAG''s expertise in surface analysis, composition and contamination measurement, trace elemental analysis and microscopy can help you and your company meet your goals, no matter what high technology industry you work in.
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Total Reflection X-ray Fluorescence (TXRF) Services
A highly surface-sensitive technique, TXRF is optimized for analyzing surface metal contamination on semiconductor wafers.
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XPS/ESCA Service
X-ray Photoelectron Spectroscopy (XPS Analysis), also known as Electron Spectroscopy for Chemical Analysis (ESCA), is used to determine quantitative atomic composition and chemistry. It is a surface analysis technique with a sampling volume that extends from the surface to a depth of approximately 50-70 Angstroms. Alternatively, XPS analysis can be utilized for X-ray Photoelectron Spectroscopy (XPS) or Electron Spectroscopy for Chemical Analysis (ESCA) from Evans Analytical Group (EAG).sputter depth profiling to characterize thin films by quantifying matrix-level elements as a function of depth.
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Field Management
EAG offers field-to-final report project management for studies to demonstrate human and environmental safety. As on-site study directors, our Field Managers bring decades of study design, protocol development, analytical oversight, and GLP/QA compliance expertise across a variety of field management study types. In addition, EAG’s access to a broad network of field sites across the United States and Canada ensures that we can deliver the test system, soil characteristics and geography necessary for just about any regulatory need.
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Inductively Coupled Plasma Spectroscopy (ICP-OES/MS), ICP Analysis Services
ICP-OES measures the light emitted at element-specific characteristic wavelengths from thermally excited analyte ions . This light emitted is separated and measured in a spectrometer, yielding an intensity measurement that can be converted to an elemental concentration by comparison with calibration standards. ICP-MS (ICP-Mass Spec) measures the masses of the element ions generated by the high temperature argon plasma. The ions created in the plasma are separated by their mass to charge ratios, enabling the identifcation and quantitation of unknown materials. ICP-MS offers extremely high sensitivity (i.e. low detection limits) for a wide range of elements
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ATE Test & Engineering Services
We can provide a limited scope project or a full turn key solution where we analyze a data sheet and provide a full test plan. Our wide range of ATE test equipment and experienced team can support first silicon debug to release to high volume production for a wide range of products, from Digital to RF, including wafer sort and packaged part testing. Test platforms include Verigy, Teradyne, Advantest.
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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ESD Testing & Latch-Up Testing Services
EAG is an industry leader in ESD testing (Electrostatic Discharge) and Latch up testing. Our highly experienced engineering team use their industry leading knowledge and years or real world experience of the latest semiconductor technologies, circuit design, and device physics to optimize our customer's ESD and latch-up results. Human Body Model (HBM) and Machine Model (MM), Charged Device Model (CDM), Latch-up, Transmission Line Pulse (TLP).
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Microelectronics Test & Engineering Services
EAG's Microelectronics Test and Engineering lab network provides semiconductor and electronics design firms worldwide with test, debug, and early engineering support to help you with new product introduction. We actively service a broad range of semiconductor and electronics companies worldwide. Services include ATE testing, Reliability testing and qualification, ESD testing, Failure Analysis, FIB Circuit Edit and Debug. for both ICs and systems
