Tokyo Seimitsu Co., Ltd.
Manufactures and sells semiconductor manufacturing equipment and measuring instruments.
- 042-642-1701
- 042-642-1798
- 2968-2, Ishikawa-machi
Hachioji-shi, Hachioji-shi 192-8515
Japan
-
product
X-ray CT System
The surface and the internal parts, in one measurement. We provide “Dimensional X-ray CT System” that does not only observe the interior of the workpiece, but that can also perform high precision, contactless measurements.
-
product
Auxiliary Equipment For Dicing Machines
We have a lineup of package singulation machines, automatic cleaning systems, chillers, etc. that support the dicing process.
-
product
Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
-
-
product
Precision ACCRETECH Dicing Tools
Precision ACCRETECH Dicing Tools for precision cutting are derived from our unique development technology as well as our diverse application technology. We offer products that can cut a variety of materials, cover diverse cutting applications and satisfy today's requirement of "high quality & low cost".
-
product
Dedicated Measuring Machine
We offer measurement systems optimized for various production sites. We design and manufacture high precision, stable specialized measuring instruments to match requested specifications and requested performance.
-
product
Auxiliary Equipment For Probing Machines
We have a lineup of products that support the probing process.
-
product
Roundness And Cylindrical Profile Measuring Instruments
We respond to a variety of needs with our lineup including both rotating table types that enable high precision measurement of cylindrical workpieces, and rotating type detectors that handle eccentric or heavy workpieces.
-
product
Discharge Test System
The automated testing equipment automatically performs charge and discharge of energy devices such as the rechargeable batteries(cells, modules, packs) that are installed in PHV/ EV and mobile devices, while measuring the voltage, current, temperature, and impedance.
-
product
Non-contact Displacement Sensors
This is a flexible sensor that can be installed anywhere and is equipped with high environmental resistance enabling use in harsh environments.
-
product
Laser Interferometers
Measurements of the length displacement or yawing and pitching, measurements of rotation angles, measurements of overshoots during vibrations or when stopped and of uneven speed, etc. can be handled. Length measuring instruments can be used for a variety of purposes, including precise inspection of heavy duty equipment.
-
product
Dicing Machines
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
-
product
CMP
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
-
product
Surface Texture And Contour Measuring Instruments/Systems
We provide high performance, easy-to-use systems from highly efficient hybrid types that can measure the surface roughness and the contour in one trace, to portable types that can be used even on the production site.
-
product
High Rigid Grinder
High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials.
