OAI
OAI is a leading manufacturer of reliable, precision equipment for MEMS, semiconductors, nanotechnology, cleanroom automation, and for UV light measurement.
- 800-843-8259
408-232-0600 - 408-433-9904
- sales@oainet.com
- 464 South Hillview Drive
Milpitas, CA 95035
United States of America
Categories
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product
Standard Class AAA Solar Simulator
TriSOL TSS
Essential for testing virtually any material or product that is exposed to sunlight for long or short periods of time, OAI’s low-cost, Standard Solar Simulators deliver highly collimated, uniform light. Depending on configuration, output on these Solar Simulators is rated at 350W -5,000W.These Class AAA Solar Simulators feature OAI’s Advanced Uniform Beam Optics and are available with a choice of air mass filters to reproduce a wide range of solar spectra. For added flexibility, OAI’s proven lens and collimating mirror technology allows for a variety of exposure area sizes. A Class AAA Solar Simulator is an essential tool for manufacturing as well as R&D; it is indispensable in test labs, industry, and in universities. OAI Standard Solar Simulators are used in photobiology, biomedical, solar cell testing, cosmetic testing, and paints & coatings analysis. Based on 35+ years of proven UV light technology, OAI Solar Simulator Systems deliver repeatable, reliable, constant output, and measurement uniformity.
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Single Long Pulse Solar Simulator & I-V Test System
TriSOL SLPSS
The OAI Test System for HIGH EFFICIENCY SOLAR CELLS overcomes the limitations of flash testing by providing a highly optimized pulse width and voltage sweep rate to match the cell’s dielectric response speed. As a result, the system produces extremely accurate measurements of solar cell efficiency leading to increased profitability.
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Custom Solutions for UV Intensity Meters & Radiometers
OAI offers custom designed solutions built to your unique specification.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Enhanced UV Light Source
Model 30E
The Model 30E Enhanced UV Lightsource is highly efficient and may be utilized in a variety of applications. Light is collected by an ellipsoidal reflector and focused on an integrating/condensing lens array to produce uniform illumination at the exposure plane. This UV light source is available in various beam sizes up to 24 inches square with output spectra ranging from 220 nm to 450 nm, using the appropriate lamp (included). Output power ranges from 200 watts to 5 kilowatts. All OAI UV Lightsources are easily equipped with quick-change filter assemblies, enabling the user to customize the output spectrum with little effort. Optional remote exhaust fans are available.
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Large Substrate Mask Aligner
Model 6020
The Model 6020 is a large substrate Production Mask Aligner or Auto-flood Exposure System for RDL First Level Advanced Packaging (PLP) and markets requiring exposure of large glass panels. It is engineered with OAI’s precision, reliability, and quality that is found in all of OAI’s products. The features include wedge effect leveling, superb process repeatability, ≤ 2.0µm printing resolution, and remote diagnostics. Using robotic handling, the system can stand alone or be fully integrated with photo resist processing.
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Exposure Systems
Model 2012AF & 2012SM
The Model 2012AF Flood Exposure System provides a cost-effective method for automated flood exposure. Designed to accommodate wafers from 8” to 300mm, the tool features automated FOUP loading. Mask and substrate changeover can be accomplished quickly and easily adding to both versatility and high-volume throughput of this production tool.The Model 2012SM Automated Edge-bead Exposure System provides a cost-effective method for edge-bead removal using standard shadow mask technology. Designed to accommodate wafers from 8” to 300mm, the tool features automated FOUP loading. Mask and substrate changeover can be accomplished quickly and easily adding to both versatility and high-volume throughput of this production tool.
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Tabletop Mask Aligner
Model 200
The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
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Large Area UV Light Source
Model 30L
The OAI UV Light Source Grande is a large area collimated light source. The device is available with output power up to 10KW. Utilizing collimating mirrors, the UV Light Source Grande is a highly efficient UV light source intended for a variety of larger-scale applications.
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