Advantest Corp.
Automated Testing Equipment (ATE) verify the quality, performance and reliability of semiconductors by electrically testing these complex and multifarious functions of semiconductors with high accuracy. The automated testing technologies from Advantest at the top of the industry are contributing to higher efficiency in production on customer sites, technological innovations of the electronics industry, and greater safety, security and comfort for society.
- +81-3-3214-7500
- +81-3-3214-7712
- webmaster@advantest.com
- Shin Marunouchi Center Bldg.
1-6-2, Marunouchi, Chiyoda-ku,
Tokyo, 100-0005
Japan
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Display Driver Test System
T6391
Test System
High-resolution flat-panel displays (LCDs / OLEDs) are becoming increasingly integrated. It is common for today's display driver ICs (DDIs) to contain a multitude of logic/analog circuits to manage advanced operations including touch-sensor functions. At the same time, the rapidly growing applications of LCDs / OLEDs in mobile electronics are driving demand for DDI's with smaller sizes and greater capabilities. These factors present serious IC-testing challenges. ADVANTEST's T6391 system is designed to address these needs along with DDIs' increasing number of pins and faster interfaces.
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Product
Memory Test System
T5830/T5830ES
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Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Product
Memory Burn-In Tester
H5620/H5620ES
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As Server and Mobile applications have mainly led the Memory and market has also entered a super cycle that has completely withdrawn from the previous silicon cycle.Memory capacitance will continue to rise as the application of data processing and mobile communication occurs—however, revenue will not grow as ASP goes down. Suppliers need to reduce test costs and increase profits.H5620 contributes to reduction of test cost by integrating the test process of DRAM Burn-in and Core Test. This hybrid memory test solution solves the challenge of reducing test costs while increasing test efficiency in the expanding DRAM market.
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Product
Memory Test System
T5801
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Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
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Product
Test Handler
HA1200
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The new HA1200 handler can be linked with a tester to utilize our unique active thermal control technology for testing singulated and/or partially assembled dies. This technology enables testing of powerful high-end SoCs with 100% test coverage. This helps reduce yield loss at final test, thus reducing losses of final multi-die assembled products.
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Product
Memory Test System
T5835
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The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Product
SoC Test System
T2000
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SoC devices require small-lot high-mix manufacturing methods in the present era of rapid generation change. Semiconductor makers struggle with requirements to replace their testers on a 2-3 year cycle. The T2000 addresses their needs by enabling rapid response to market needs with minimum capital investment.
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Product
Performance Board
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The role of the performance board is accurate transmission of tester signals all the way to the device leads. Custom performance boards from ADVANTEST deliver support for DUTs (devices under test), as they become faster and smaller, with greater pin counts, and increasingly take the form of SMDs. ADVANTEST performance boards also support a host of test requirements, such as analog test, high-speed performance, and high-density, for testing state-of-the-art ICs.
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Product
Test Handler
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Test Handler is an equipment that automates the final testing of semiconductor devices. It handles device transportation, controls temperature during semiconductor testing, and sorts devices based on test results.
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Product
Component Test Systems
Test System
These products include test peripherals used with test systems, such as interfaces that connect semiconductor devices with test systems, and handlers that transport semiconductors to the test system. System-level test equipment and software are also included in this category.
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Product
SSD Test Systems
MPT3000ES / MPT3000ES2
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Using the same high-performance electronics and powerful software as all products in the MPT3000 family, the MPT3000ES and MPT3000ES2 engineering stations feature a small footprint configured to test up to eight SSDs in parallel. The system's small size and ability to plug into a standard AC outlet enable users to conduct program development and interactive device debugging in either office or lab settings.
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
TDR System
TS9001
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The system accurately analyzes the wiring quality of various leading-edge semiconductor packages such as Flip Chip BGA, wafer level packages, and 2.5D/3D ICs using terahertz technology. It is a TDR analysis system that has the world’s top-class signal quality.
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Product
Terahertz Systems
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Terahertz waves are electromagnetic waves in the frequency band between radio waves and light waves. It combines the transmissivity of radio waves and the straightness of light waves and provides fingerprint spectra based on intermolecular interactions from small molecules to high polymers. By utilizing of this characteristic for spectroscopic and imaging measurements, it is possible to apply them to nondestructive analysis that has never been done before.
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W2BI Inc.
W2BI envisages an optimized user experience of seamless communication between an array of wireless devices defined by adaptability, inclusivity and independence. We envision W2BI as being the global forerunner in shaping this interoperability within the automated wireless industry. A member of the Advantest Group
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Cloud Testing Service, Inc.
CloudTesting™ Service leverages recent advances in cloud computing that have transformed the concept of ownership from physical possession of an asset to a licensing agreement, with the asset itself residing in the cloud. Applying this paradigm to semiconductor test, we built a business model that expands customer access to testers by delivering test IP directly to their personal computers.
Children
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R&D Altanova
R&D Altanova is the leading provider of full turn-key test interface solutions specializing in Advanced Technology Printed Circuit Board Engineering, Design, Fabrication, and Assembly and Manufacturing services.
