ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
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Product
PICMG Single Board Computers
Single Board Computer
ADLINK's industrial Slot Single Board Computers (SBCs) and backplanes follow PCI Industrial Computer Manufacturers Group (PICMG) 1.0 and 1.3 standards, with card-on-backplane architecture delivering faster Mean Time to Repair (MTTR) over conventional motherboard designs, flexible backplane configurations, functional with a broad range of off-the-shelf peripheral cards. ADLINK’s wide range of PICMG 1.0/1.3 CPU board-compatible backplanes are fully co-functional with ADLINK systems, for flexible configuration and expandability in industrial applications.
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Product
EtherCAT Slave System
EPS Series
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The ADLINK complete EtherCAT solution, from hardware to middleware to software, with every element tailored for dedicated EtherCAT functionality, includes PCIe-833X Series master controllers, EPS slave systems, and remote monitoring and control providers. As well, ADLINK’s Softmotion one-stop control kernel delivers flexible and easy-to-use intelligent platforms for driving next-generation modern Smart Factories. ADLINK's EPS slave system brings the power the flexibility to EtherCAT environments. State-of-the-art modular construction allows the EtherCAT slave to be configured to fulfill the needs of both small local applications and expansive distributed platforms. The EPS system with comprehensive and high-density I/O modules that include DI/O, pulse-chain motion modules. Leveraging ARM and FPGA technologies, the EPS slave is able to monitor and report system integrity via EtherCAT communication, while relay module lifecycle and signal integrity of analog output are monitored cyclically, and hot swappability reduces downtime significantly. Uniquely designed for full operability in conditions from -20°C to 60°C,the EPS slave system is also fully compliant with the EN 60068-2 standard for shock and vibration and EN 61000-6 for heavy industrial EMC protection, as well as emission certification. Corresponding ESI files for each EPS system can be generated thru ADLINK's Windows-based EtherCAT slave utility, LinkMasterPro™.
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Product
Rugged Conduction Cooled 3U CompactPCI Processor Blade with Quad-Core Intel® Atom™ Processor
CT-3620
Processor Blade
The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).
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Product
Isolated USB Digital I/O Modules (OEM Version Available)
USB-7230/7250
Data Acquisition Module
The USB-7230/7250 USB-based digital I/O modules feature high voltage on/off control and monitoring, and isolation voltage supported up to 2500VRMS. The USB-7230 provides 32-CH isolated digital I/O and 2-CH frequency/event counters. The USB-7250 provides 8-CH relay output (4 form C and 4 form A), 8-CH isolated DI, and 2-CH frequency/event counters. The USB-powered USB-7230/7250 features removable screw-down terminals for easy device connectivity, and the included multi-functional stand fully supports desktop, rail, or wall mounting.
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Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7210
MEC Server
The MECS-7210 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. As one of the first NGC-Ready validated and OTII compliant edge servers, the MECS-7210 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 420mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and dual FHFL PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7210 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
Computer on Module
Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
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Product
COM-HPC
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The PCI Industrial Computer Manufacturers Group (PICMG) is now entering the final stages in the development of the new COM-HPC computer-on-module specification that will address the needs of the very high end of the industrial edge computing market.
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Product
Carrier Board Design and Software Verification Computer-on-Module Starter Kit
Starter Kit - ETX
Carrier Board
- ETX module of choice- CPU, Memory of choice- Thermal Solution (heatspreader, and heatsink) of choice- Reference Carrier Board- Schematics, Design Guide, and User Manuals- ADLINK USB Stick with Documentation, Software
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Product
High Speed Link Extension Modules
HSL-HUB3/Repeater
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HSL system is a great remote real-time I/O control solution. HSL-HUB3/Repeater comes with HSL technology and provides much flexibility in HSL system topology and extension. Machine makers and FA planners can use this extension module to install subsystem and process remote side (2.4 km) I/O even motion control.
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Product
8-CH Relay Outputs & 8-CH Isolated DI Card
LPCIe-7250
Relay
LPCIe-7250 provides 8-CH SPDT (Form C) relay outputs and 8-CH isolated digital inputs. The status of each relay output is represented by an onboard LED. When the relay is in SET condition, its corresponding LED will turn ON, and on the contrary, it is OFF. All digital input channels are non-polarity, optically isolated, and may be set to use RC filter or not. The devices are suitable for collecting digital inputs in noisy environments.
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 Processor
IMB-M45H
Motherboard
ADLINK IMB-M45H ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 processor in the LGA1151 package, and the Intel H310 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe Gen3, USB 3.1 Gen1 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz memory up to 64 GB in two DIMM slots.
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Product
Embedded ROS 2 Robotic Controller Powered By NVIDIA® Jetson AGX Orin ™ Module
RQX-59 Series
Robotic Controller
Introducing the revolutionary ROScube-X RQX-59 Series, a state-of-the-art ROS 2 robotic controller powered by the incomparable NVIDIA® Jetson AGX Orin™ module. The RQX-59 Series ensures seamless integration into robotic and autonomous driving applications, thanks to its integrated powerhouse NVIDIA CUDA® GPU and dual deep learning accelerators. Additionally, it offers a wide range of interfaces, including GMSL1/2 or FPD-Link III cameras. Get ready to redefine the boundaries of robotic possibilities with the RQX-59 Series, the epitome of efficiency and innovation.
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Product
Vision Systems
System
Embedded vision systems, also referred to as compact vision systems, offer an alternative to Smart cameras and computer-based systems. The ADLINK EOS series is a complete embedded system that offers image acquisition, processing, archiving, and display capabilities. It is equipped with a multi-core CPU, ideal for applications requiring high computing power and multi-camera imaging, such as 3D vision and robotics guidance. Featuring rich I/O connectivity with factory-floor networks, including RS-232/422/485, USB, and isolated digital I/O, as well as onboard storage, ADLINK’s embedded vision system is ready to deploy. A system monitoring feature, feeding back temperature and voltage data, combines with a watchdog timer to maximize robustness and reliability of the ADLINK EOS series in mission critical applications.
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Product
SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
Computer on Module
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.






















