Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.
- (503) 268-8000
- (503) 268-8169
- sales@latticesemi.com
- 5555 NE Moore Ct
Hillsboro, OR 97124
United States of America
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Product
Hardware Security For Programmable System Control
Mach-NX
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*Up to 8.4K LC of user logic, 2669 kbits of user flash memory and dual boot flash feature*Up to 379 programmable I/O supporting 1.2/1.5/1.8/2.5/3.3 I/O voltages*Secure enclave supports 384-bit cryptography, including SHA, HMAC, and ECC*Configuration of PFR and security functions through Lattice Propel simplifies developer experience*Highly reliable. Low power and 3X better SER performance to comparable CMOS technologies
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Product
Best In Class, Easy To Use Design Software
Lattice Radiant Software
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Full Featured, Easy to Use Tool Suite - Lattice Radiant software offers all the best in class tools and features to help users develop their FPGA applications efficiently and effectively. Powerful yet intuitive tools provide fast design starts and precise implementation.
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Product
Embedded Vision And Processing FPGA
CrossLink-NX
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*Instant-on configuration – IO configures in 3 ms, and device as fast as 8 ms*Two hardened 4-lane MIPI D-PHY transceivers at 10 Gbps per PHY / 2.5 Gbps per lane*Up to 37 programmable source synchronous I/O pairs for camera and display interfacing
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Product
Low Power FPGA Featuring Hardened MIPI D-PHY, LVDS, SLVS, SubLVDS, & Open LDI Bridging
CrossLink
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*Two 4-lane MIPI D-PHY transceivers at 6 Gbps per PHY*15 programmable source synchronous I/O pairs for camera and display interfacing*Available in amazingly small 2.46 mm x 2.46 mm WLCSP packages and BGA packages with 0.4 mm, 0.5 mm and 0.65 mm pitch
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Product
Manage Power, Thermal & Control Planes In Real Time
Platform Manager 2 & L-ASC10
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*Full fault coverage – monitor all rails and temperature nodes*Manage from 10 to 80 supplies using just the required number of L-ASC10 hardware management expanders*Minimize fault propagation by enabling individual hardware management sub-blocks (power, thermal & control path) to respond to faults in other blocks within nano-seconds*Save CPLD I/O pins by eliminating the need to monitor power-good signals of DC-DC converters*Reliable power & thermal fault detection in hardware, as opposed to software routines
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Product
Low-power, High-performance FPGA
iCE40 LP/HX
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*Available in three series with LUTs ranging from 384 to 7680: Low power (LP) and high performance (HX)*Integrated hard I2C and SPI cores that enable flexible device configuration through SPI*Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI*Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS*Up to 128 kbits sysMEM™ Embedded Block RAM*Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications
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Product
Integrated Board Power Management Functions For The Forward Thinking Engineer
Power Manager II
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*Up to 12 differential voltage sensors with immunity to noise on ground plane*Voltage trimming to within 1%*Ruggedized CPLD with up to 48 macrocells for sequencing and supervisory signal logic*Large operating power supply range (3.3 V + 20% to 3.3 V -15%)*Up to 4 High-Voltage MOSFET Driver Outputs*Voltage Measurement with 10-bit ADC through I2C*Up to 8 On-chip DACs for Margining and Trimming
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Product
Enhance Secure Control Applications
MachXO3D
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*Simplifies implementation of hardware security by integrating Root-of-Trust in your platform’s first on, last off device*Supports security throughout the product lifecycle including device manufacturing and transport, platform manufacturing, installation, operation and decommissioning
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Product
Bridging And I/O Expansion Versatility. Rapid Hardware Acceleration For Improved Signal Control.
MachXO2
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*Up to 256 kbits of user Flash memory and up to 240 kbits sysMEM™ embedded block RAM*Up to 334 hot-socketable IOs that avoid excess leakage*Programmable through JTAG, SPI, I2C or Wishbone*TransFR feature allows in-field design update without interrupting equipment operation*Programmable sysIO™ buffer supports LVCMOS, LVTTL, PCI, LVDS, BLVDS, MLVDS, RSDS, LVPECL, SSTL, HSTL and more
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Product
PLD For Bridging, Infinitely Reconfigurable I/O Expansion.
MachXO
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*Up to 27.6 Kbits sysMEM™ embedded block RAM and up to 7.7Kbits distributed RAM*SRAM based logic can be reconfigured in milliseconds using JTAG port*IOs support LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS*Up to two analog PLLs per device that enable clock multiplication, division, and phase shifting*Available in TQFP, csBGA, caBGA and ftBGA packages
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Product
Mature & Discontinued Devices
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The product families on this page have been classified as "Mature". In most cases there is a newer technology product family that will better meet the needs of today's system logic designers. Designers working on new designs are strongly encouraged to evaluate the alternative product families listed in the "Use for New Designs" column. Unless a Mature Family has been formally superseded via our Product Change Notification (PCN) procedure Lattice will continue to support existing business for these Mature products. Certain of the products for which the PCN process has been completed have been transferred, as indicated in the table, to Rochester Electronics or Arrow Electronics. Please contact those companies for availability of the products indicated.
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Product
Enabling Low Power, High Reliability, And High Performance Design
Lattice Nexus Platform
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The Lattice Nexus FPGA platform combines Lattice’s long-standing low power FPGA expertise with leading 28nm FD-SOI semiconductor manufacturing technology. With this platform, Lattice enables the rapid development of multiple device families that deliver low power, high performance, high reliability and small form factor.
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Product
Futureproof Your Control PLD And Bridging Designs
MachXO3
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*Up to 9400 LUTs with up to 384 I/O pins*Instant-on 1 ms boot-up with background upgrade, Hitless I/O reconfigure and dual-boot error recovery*Available with 3.3/2.5 V core or low power 1.2 V core – including additional options on 9400 LUT devices*MachXO3LF includes programmable Flash and User Flash Memory (UFM)*Available in amazingly small (2.50 x 2.50 mm, 0.4 mm pitch) WLCSP packages and BGA packages with 0.50 mm and 0.80 mm pitch
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Product
Efficiency And Innovation, Squeezed Into One Tiny, Affordable Package
LatticeECP3
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*Up to 16 channels at 3.125 Gbps*800 MBps DDR3, 1Gbps LVDS*Up to 586 programmable sysIO buffers with support for PCI Express, Ethernet (GbE, XAUI, & SGMII), HDMI, SMPTE, Serial Rapid I/O, CPRI and JESD204A/B and more*Up to 150 k LUTs and 6.8 Mbits of SRAM*Wide array of packages as small as 10.0 mm x 10.0 mm with power consumption below 0.5 W
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Product
Rapidly Compile Networks For Implementation On Lattice SensAI IP Cores
Neural Network Compiler
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Analyze networks for fit in the chosen number of engines and allocated memory. After compilation, simulate networks for functionality and performance prior to testing in hardware. Graphical display of networks supports analysis and understanding.
