Smiths Interconnect

Product

WLCSP Probe Heads

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Smiths Interconnect

Smiths Interconnect

Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.

Product

Robust Modular Rectangular Connectors

B Series

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Smiths Interconnect

B Series - Smiths Interconnect

Smiths Interconnect addresses the industry’s need for reliable, low cost interconnections with the rectangular modular connectors B Series. B Series incorporates the highly reliability Hypertac® hyperboloid contact which provides optimum performance in harsh conditions such as extreme mechanical shock and high mating cycles.

Product

Backplane Connectors

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Smiths Interconnect

Smiths Interconnect

Offering a broad portfolio of backplane connectors that include SOSA aligned optical, COTS plus hard metric, VITA standard and high speed twinax interconnects. Our interconnect solutions address the requirements of mission-critical applications within commercial aerospace, space and defense market segments.

Product

Miniature Snap Fit Connectors

SnapTac® Series

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Smiths Interconnect

SnapTac® Series - Smiths Interconnect

Smiths Interconnect's SnapTac® Seriess is a lightweight, robust, quick release miniature connector, featuring IP67 sealing and EMI shielding. The series is available in both circular (7, 13, 19 ways) and rectangular (12, 21, 30 ways) styles. They are equipped with Hyperspring contacts, designed to protect the electrical interface against extreme environmental conditions.

Product

Optical Transceivers

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Smiths Interconnect

Smiths Interconnect

Based on Reflex Photonics technology, these rugged embedded transceivers offer bandwidth up to 300 Gbps in a chip-sized component. Designed for harsh environments including space, military, aerospace, and industrial applications, the transceivers provide high I/O density with low SWaP. Versions are available for mounting mid-board, front-panel, or on a VPX backplane (aligned with the SOSA™ technical standard).

Product

Embedded Transceivers

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Smiths Interconnect

Smiths Interconnect

Embedded transceivers are chip-sized components based on 850 nm VCSELs and offer bandwidth up to 300 Gbps for short reach applications (<300 m). These transceivers can be soldered or socketed to a printed circuit board and are well suited for small, compact systems requiring high I/O density, low power, and small space. Many of these transceivers have been qualified to operate in harsh environments, such as the ones found in space, and aerospace and defense applications.

Product

Interface Pin

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Smiths Interconnect

Smiths Interconnect

Smiths Interconnect offers interface probes for all major test equipment manufacturers. We also provide a variety of interface pins for use in test fixtures.

Product

Switch Probes

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Smiths Interconnect

Smiths Interconnect

A Switch Probe is a spring contact probe and receptacle combination that is normally open, and after a designated travel the switch probe closes. The most common use for switch probes is in the cable harness testing industry. The switch probe is used to verify the correct location of a terminal in a connector while checking the retention force as well. Switch probes also verify the presence of nonconductive components such as caps for connectors or devices on a circuit board. Smiths Interconnect offers three standard sizes of switch probes.

Product

Connectors

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Smiths Interconnect

Smiths Interconnect

Through our Hypertac, IDI and Sabritec technology brands, we supply application-specific, high-reliability electrical interconnect solutions from highly integrated assemblies to microminiature connectors and spring probe contacts. The core of our advanced interconnect solutions is our contact technologies: Hyperboloid, Tortac, Spring Probe, High Speed, Edge Card, Fiber Optic, EMI/EMP, High Power and High Temperature.

Product

Semiconductor Test

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Smiths Interconnect

Smiths Interconnect

Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.

Product

Signal & Power PCB Connector

HPW Series

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Smiths Interconnect

HPW Series - Smiths Interconnect

Smiths Interconnect's HPW series is a versatile interconnect with mixed signal and power contacts, up to 15A each

Product

High density PCB connectors

MHD/MDD/MDP Series

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Smiths Interconnect

MHD/MDD/MDP Series - Smiths Interconnect

Smiths Interconnect's MHD/MDD/MDP series is an ESA qualified, high density board to board and board to wire interconnect available in up to 400 positions, with available insulators to accommodate coax and power contacts.

Product

Isolators & Circulators

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Smiths Interconnect

Smiths Interconnect

Smiths Interconnect's Isolators and Circulators set the industry benchmark for low loss and high power performance in the most stringent Military and Space environments.

Product

PCB Connectors

HPH Series

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Smiths Interconnect

HPH Series - Smiths Interconnect

Smiths Interconnect's HPH series is a high density interconnect available up to 303 contacts with multiple hardware choices and backpotting option

Product

Couplers

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Smiths Interconnect

Smiths Interconnect

Smiths Interconnect range of passive coaxial products include couplers of various types (Wilkinson, Directional and Branchline) designed specifically for established reliability applications to provide optimal performance operating in assigned frequencies ranging from UHF to Ku-Band. The couplers featured below have been developed and qualified to operate in extreme operational environments whilst providing designers and system architects with reliable and robust products produced by a manufacturing team experienced in the production of critical application hardware.