Celadon
Celadon Systems is a well-established 20 year old US based company known for providing “Peace of Mind” Probing Solutions to the semiconductor industry. Celadon’s probe cards are known for thriving in temperature extremes while still delivering accurate and precise test results. Expect Millions of Touchdowns with Celadon. Celadon delivers the Lowest Cost of Test in the industry. Celadon is an industry leader in parametric probe both in production and in the lab, device test, burn-in, modeling & characterization, and wafer level reliability.
- 952.232.1700
- salesteam@celadonsystems.com
- 13795 Frontier Court
Burnsville,, MN 55337
United States of America
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Product
Multisite Probe Card
T300 ButtonTile™
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The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Product
Probe Card
T90™ Series
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The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Product
Probe Card
VersaTile™
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Celadon has reduced the size of a probe card to 28mm with the VersaTile™ with Advanced Cantilever™ technology. The VersaTile™ with Advanced Cantilever™ technology can fit on a conventional 3-hole mount probe positioner for single site probing. The same VersaTile™ with Advanced Cantilever™ technology can be used in a 300mm VersaPlate™ for multi-site probing.
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Product
Probe Cards
Minitile™ with Advanced Cantilever™ technology and WedgeTile™
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Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.











